This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Samtec Incorporated. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Richard Mellitz: Innovator in IC Die Package Testing
Introduction
Richard Mellitz is a notable inventor based in New Albany, IN (US). He has made significant contributions to the field of integrated circuit (IC) testing. His innovative approach has led to the development of a unique method for testing die package assemblies.
Latest Patents
Richard Mellitz holds a patent for a "Method and apparatus for testing a die package assembly." This invention involves a twinaxial cable splitter that is in electrical communication with an IC die package. The design includes first and second coaxial electrical cables that route electrical signals to a testing device. This device is configured to determine specific metrics of an IC chip within the die package. The method allows for effective testing of an IC die package assembly by establishing electrical communication with a first electrical connector mounted to a package substrate. This substrate includes both the package and an IC die, enabling the determination of at least one performance metric of the die package assembly.
Career Highlights
Richard Mellitz is currently employed at Samtec Incorporated, where he continues to innovate in the field of electronic testing. His work has been instrumental in advancing the technology used in IC testing, contributing to the efficiency and accuracy of performance metrics.
Collaborations
Richard has collaborated with talented coworkers, including Gauss Yang and Brandon Thomas Gore. Their combined expertise has fostered a productive environment for innovation and development in their projects.
Conclusion
Richard Mellitz is a distinguished inventor whose work in IC die package testing has made a significant impact in the electronics industry. His patent reflects his commitment to advancing technology and improving testing methodologies.