The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Feb. 04, 2021
Applicant:

Samtec, Inc., New Albany, IN (US);

Inventors:

Brandon Thomas Gore, New Albany, IN (US);

Richard Mellitz, New Albany, IN (US);

Gauss Yang, New Albany, IN (US);

Kelly Garrison, New Albany, IN (US);

Norman S. Mcmorrow, Brunswick, ME (US);

Assignee:

SAMTEC, INC., New Albany, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H01R 12/72 (2011.01); H01R 12/75 (2011.01); H01R 25/00 (2006.01);
U.S. Cl.
CPC ...
H01R 25/003 (2013.01); G01R 31/2896 (2013.01); H01R 12/722 (2013.01); H01R 12/75 (2013.01); H01R 2201/20 (2013.01);
Abstract

A twinaxial cable splitter is in electrical communication with an IC die package. First and second coaxial electrical cables are configured to route electrical signals to a testing device that is configured to determine certain metrics of an IC chip of the die package. Thus, a method is provided for testing an IC die package assembly by placing an IC package testing device in electrical communication with a first electrical connector mounted to a package substrate of the die package assembly that includes the package substate and an IC die mounted on the package substrate, and determining at least one performance metric of the die package assembly.


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