This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Samtec Incorporated. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Gauss Yang: Innovator in IC Die Package Testing
Introduction
Gauss Yang is a notable inventor based in New Albany, IN (US). He has made significant contributions to the field of integrated circuit (IC) testing, particularly through his innovative patent.
Latest Patents
Gauss Yang holds a patent titled "Method and apparatus for testing a die package assembly." This invention involves a twinaxial cable splitter that is in electrical communication with an IC die package. The design includes first and second coaxial electrical cables that route electrical signals to a testing device. This device is configured to determine specific metrics of an IC chip within the die package. The method allows for effective testing of an IC die package assembly by connecting an IC package testing device to a first electrical connector mounted on the package substrate, which includes both the substrate and the IC die. This innovation aims to assess at least one performance metric of the die package assembly.
Career Highlights
Gauss Yang is currently employed at Samtec Incorporated, where he continues to develop and refine technologies related to IC testing. His work has been instrumental in advancing the capabilities of testing methodologies in the industry.
Collaborations
Gauss has collaborated with notable colleagues, including Norman S. McMorrow and Richard Mellitz, who have contributed to his projects and innovations.
Conclusion
Gauss Yang's contributions to the field of IC testing through his patent demonstrate his commitment to innovation and excellence. His work at Samtec Incorporated continues to influence the industry positively.