This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Samtec Incorporated. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: The Innovations of Norman S. McMorrow
Introduction
Norman S. McMorrow is a notable inventor based in Brunswick, ME (US). He has made significant contributions to the field of electrical engineering, particularly in the testing of integrated circuit (IC) die package assemblies. His innovative approach has led to the development of a unique method and apparatus that enhances the efficiency of testing these critical components.
Latest Patents
Norman S. McMorrow holds a patent for a "Method and apparatus for testing a die package assembly." This invention involves a twinaxial cable splitter that is in electrical communication with an IC die package. The design includes first and second coaxial electrical cables that route electrical signals to a testing device. This device is configured to determine specific metrics of an IC chip within the die package. The method allows for effective testing of an IC die package assembly by connecting an IC package testing device to a first electrical connector mounted on the package substrate, which includes both the substrate and the IC die. This innovation provides a means to assess at least one performance metric of the die package assembly.
Career Highlights
Norman S. McMorrow is currently employed at Samtec Incorporated, where he continues to apply his expertise in electrical engineering. His work at Samtec has allowed him to contribute to advancements in the field, particularly in the area of IC testing.
Collaborations
Throughout his career, Norman has collaborated with talented individuals such as Richard Mellitz and Gauss Yang. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Norman S. McMorrow's contributions to the field of electrical engineering, particularly through his patent for testing die package assemblies, highlight his innovative spirit and dedication to advancing technology. His work at Samtec Incorporated and collaborations with other professionals further emphasize his impact in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
