Company Filing History:
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Years Active: 1995-2003
Title: The Innovative Contributions of Richard M Bymark
Introduction
Richard M Bymark is a notable inventor based in Austin, TX, who has made significant contributions to the field of materials science. With a total of two patents to his name, Bymark has focused on developing advanced compositions that enhance the performance and durability of electronic components.
Latest Patents
Bymark's latest patents include innovative encapsulant compositions with thermal shock resistance. This thermomechanical-shock-resistant cured composition is designed for solventless, hydrophobic resin encapsulation of electronic components, particularly those with a glass transition temperature below 0°C. The composition contains a non-silicone oligomer with a flexible hydrocarbon backbone and reactive functionality, along with an adhesion promoter and an optional viscosity-modifying component. Another significant patent is for rapid curing powder epoxy coating compositions, which feature an advanced thermosetting epoxy powder composition. This composition comprises a high percentage of diglycidyl ether of an aromatic bisphenol and a trifunctional polyglycidyl ether of an aliphatic polyol, along with specific curing agents and accelerators.
Career Highlights
Throughout his career, Richard M Bymark has worked with prominent companies such as 3M Innovative Properties Company and Minnesota Mining and Manufacturing Company. His work in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in material technologies.
Collaborations
Bymark has collaborated with notable colleagues, including Taun L McKenzie and Frank Y Xu. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
Richard M Bymark's contributions to the field of materials science through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry, particularly in the realm of electronic component encapsulation and coating technologies.