3m Innovative Properties Company

Minnesota Mining and Manufacturing Company

Richard M Bymark

Taun L McKenzie

Frank Y Xu

Wayne Scott Mahoney

Rolf W Biernath

Michael A Kropp

Wendy L Thompson

Allen L Griggs

James S McHattie

A thermomechanical-shock-resistant cured composition for solventless, hydrophobic resin encapsulation of electronic components having a glass transition temperature below 0&deg; C. and containing a non-silicone oligomer including a flexible hydrocarbon backbone with reactive functionality, up to about 40% by weight of an adhesion promoter, and a optional viscosity-modifying component.

Encapsulant compositions with thermal shock resistance

An advanced thermosetting epoxy powder composition comprising from about 95 epoxide equivalent percent to about 99 epoxide equivalent percent of a diglycidyl ether of an aromatic bisphenol, from about 1 to about 5 epoxide equivalent percent of at least one trifunctional polyglycidyl ether of an aliphatic polyol, a curing agent selected from the group consisting of dihydric bisphenol such as bisphenol-A and mixtures of bisphenol-A and bisphenol A endcapped diglycidyl ether of bisphenol A, and a curing accelerator selected from the group consisting of imidazoles and imidazole adducts with polyglycidyl ether of aliphatic polyol.

Rapid curing powder epoxy coating compositions having increased

Growing community of inventors

Austin, TX, United States of America

Richard M Bymark