The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2003
Filed:
Dec. 20, 1999
Applicant:
Inventors:
Richard M. Bymark, Austin, TX (US);
Frank Y. Xu, Austin, TX (US);
Rolf W. Biernath, Maplewood, MN (US);
Michael A. Kropp, Cottage Grove, MN (US);
Wayne S. Mahoney, St. Paul, MN (US);
Taun L. McKenzie, North St. Paul, MN (US);
Wendy L. Thompson, Roseville, MN (US);
Assignee:
3M Innovative Properties Company, St. Paul, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/24 ;
U.S. Cl.
CPC ...
C08K 5/24 ;
Abstract
A thermomechanical-shock-resistant cured composition for solventless, hydrophobic resin encapsulation of electronic components having a glass transition temperature below 0° C. and containing a non-silicone oligomer including a flexible hydrocarbon backbone with reactive functionality, up to about 40% by weight of an adhesion promoter, and a optional viscosity-modifying component.