Company Filing History:
Years Active: 2003-2006
Title: Richard L. Groover: Innovator in Semiconductor Packaging
Introduction
Richard L. Groover is a notable inventor based in Chandler, AZ (US), recognized for his contributions to semiconductor packaging technology. He holds a total of 4 patents, showcasing his innovative approach in the field.
Latest Patents
One of his latest patents is for a thermally enhanced chip scale lead on chip semiconductor package and method of making the same. This invention features a substrate with multiple metal lead fingers, allowing for a semiconductor chip to be mounted in a flip-chip electrical connection. The design includes strategically placed ground and power connection pads, enhancing thermal and electrical conductivity. The lower surface of the grounding and power lands is exposed for connection to an external heat sink, optimizing the package's performance.
Career Highlights
Richard L. Groover has made significant strides in his career, particularly through his work at Amkor Technology, Inc. His expertise in semiconductor packaging has positioned him as a key player in the industry, contributing to advancements that improve device performance and reliability.
Collaborations
Throughout his career, Groover has collaborated with notable colleagues, including David McCann and Paul Robert Hoffman. These partnerships have fostered innovation and have been instrumental in the development of cutting-edge technologies in semiconductor packaging.
Conclusion
Richard L. Groover's work exemplifies the spirit of innovation in the semiconductor industry. His patents and contributions continue to influence the field, making him a significant figure in the realm of technology.