Richard J Di Murro

Title: Richard J Di Murro: Innovator in Selective Plating Technology

Introduction

Richard J Di Murro is a notable inventor based in Harrison, NJ (US). He has made significant contributions to the field of electroplating, particularly through his innovative patent for a selective plating apparatus. His work has implications for the manufacturing of electronic components, enhancing efficiency and precision in the plating process.

Latest Patents

Richard J Di Murro holds a patent for a selective plating apparatus, which is designed for the continuous electroplating of selected portions of discrete electronic components. This apparatus utilizes a conveyor belt to transport components through an electroplating station. The portions to be plated come into contact with a moving porous applicator surface that is wetted with electroplating solution, while a D.C. potential is applied. The design ensures that each component is accurately spaced and restrained from undesired movements, allowing for a consistent and high-quality plating process.

Career Highlights

Throughout his career, Richard has been associated with Auric Corporation, where he has applied his expertise in electroplating technology. His innovative approach has led to advancements in the manufacturing processes of electronic components, making them more efficient and reliable.

Collaborations

Richard has collaborated with notable coworkers such as Maurice Bick and Jean A Lochet. Their combined efforts have contributed to the development of advanced technologies in the field of electroplating.

Conclusion

Richard J Di Murro's contributions to selective plating technology exemplify the impact of innovation in manufacturing. His patent and work at Auric Corporation highlight the importance of precision in the production of electronic components.