Selective plating apparatus

Abstract

Apparatus for continuous electroplating of selected portions of discrete electronic components. The components are carried by a conveyor belt through an electroplating station where the portions to be plated make contact with a moving porous applicator surface wetted with the electroplating solution, while a D.C. potential is suitably applied. The respective movements of conveyor and applicator surfaces are such that the trace of each conveyed component upon the applicator surface continuously overlies fresh electroplating solution. The conveyor belt passes through a channel in a stationary guide means at the electroplating station, which accurately spaces the components with respect to the applicator and restrains the components from undesired wobble or vertical movements. The leads of the components, which are connected to electrically isolated terminals on the die-receiving face of the component, protrude from the guide as they progress through the channel therein. Electrical contact with the leads, for purposes of plating the isolated terminals, is made by a stationary or moving flexible conductor means, such as a wire brush, which overlies the guide and is supplied with the aforementioned D.C. potential.