Richard Handly Shanaman, Iii

Title: Richard Handly Shanaman, III: Innovator in Semiconductor Technology

Introduction

Richard Handly Shanaman, III is a notable inventor based in Richland, PA (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the performance and reliability of integrated circuits.

Latest Patents

One of his latest patents is titled "Heat sink formed of multiple metal layers on backside of integrated circuit die." This invention involves an integrated circuit die that includes a substrate with electrical circuits on the front surface and multiple metal layers on the back surface. The design facilitates effective heat dissipation, which is crucial for the performance of integrated circuits.

Another significant patent is "Semiconductor device configured for reducing post-fabrication damage." This invention addresses the issue of post-fabrication damage in semiconductor devices. It features an IC die with beveled perimeter edges, which are created through an etching process. This innovative design helps in reducing damage during the manufacturing process.

Career Highlights

Richard is currently employed at Agere Systems Inc., where he continues to develop cutting-edge technologies in the semiconductor industry. His expertise and innovative mindset have made him a valuable asset to the company.

Collaborations

Throughout his career, Richard has collaborated with talented individuals such as John McKenna Brennan and Joseph Michael Freund. These collaborations have contributed to the advancement of technology in their respective fields.

Conclusion

Richard Handly Shanaman, III is a distinguished inventor whose work in semiconductor technology has led to several important patents. His contributions continue to influence the industry and enhance the performance of integrated circuits.