The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2006
Filed:
Feb. 26, 2004
John Mckenna Brennan, Wyomissing, PA (US);
Joseph Michael Freund, Fogelsville, PA (US);
Curtis James Miller, West Lawn, PA (US);
Richard Handly Shanaman, Iii, Richland, PA (US);
John McKenna Brennan, Wyomissing, PA (US);
Joseph Michael Freund, Fogelsville, PA (US);
Curtis James Miller, West Lawn, PA (US);
Richard Handly Shanaman, III, Richland, PA (US);
Agere Systems Inc., Allentown, PA (US);
Abstract
A method for attaching at least one IC die to a non-ceramic IC package including a leadframe and a base, the IC package being configured for receiving the at least one IC die, includes attaching the IC die to an upper surface of a thermal carrier in a manner which facilitates thermal transfer between the die and the carrier. The method further includes attaching the thermal carrier having the IC die attached thereto to an upper surface of the base of the IC package. In this manner, one or more IC dies may be attached to a standard plastic IC package without a significant impact on thermal transfer in the device and at a significant cost savings compared to ceramic IC packages.