Richard H Sworden

Title: Innovations of Richard H Sworden in Functionally Graded Metal Substrates

Introduction

Richard H Sworden is an accomplished inventor based in Tucson, AZ (US). He is known for his innovative work in the field of materials science, particularly in the development of functionally graded metal substrates. His contributions have significant implications for microelectronic packaging and other advanced applications.

Latest Patents

Richard H Sworden holds a patent for "Functionally graded metal substrates and process for making same." This invention provides a functionally-graded metal substrate composed of at least two metal compositions, a functional insert, and a surrounding body. The process involves placing a functional insert powder composition in a compact of a surrounding body powder composition, followed by sintering both metal compositions in a furnace. The resulting sintered part can be infiltrated with a molten metal compound, achieving a density of at least 90% of theoretical. This innovative substrate allows for the attachment of heat-generating components, such as chips, enhancing its utility in microelectronic applications.

Career Highlights

Richard H Sworden has made significant strides in his career, particularly through his work at Brush Wellman, Inc. His expertise in materials science and engineering has led to advancements in the production and application of functionally graded materials. His patent reflects his commitment to innovation and the development of new technologies that meet industry needs.

Collaborations

Throughout his career, Richard has collaborated with notable colleagues, including Juan L Sepulveda and David E Jech. These collaborations have fostered a creative environment that encourages the exchange of ideas and the pursuit of groundbreaking solutions in materials science.

Conclusion

Richard H Sworden's contributions to the field of functionally graded metal substrates exemplify the importance of innovation in advancing technology. His work not only enhances microelectronic packaging but also sets the stage for future developments in materials science.