Company Filing History:
Years Active: 2003-2004
Title: The Innovations of Richard D. James
Introduction
Richard D. James is a notable inventor based in Plano, TX (US). He has made significant contributions to the field of technology, particularly in the area of ball grid array (BGA) packaging. With a total of 3 patents to his name, his work has had a considerable impact on enhancing the reliability of electronic components.
Latest Patents
Among his latest patents is a process for fabricating a ball grid array package for enhanced stress tolerance. This innovative method significantly reduces the thermomechanical stress sensitivity of BGA solder connections. The solder connections solidify in column-like contours after the reflow process, achieved by using solder material in tapered openings of a thick sheet-like elastic polymer. This polymer is adhered to the BGA substrate and is selected for its non-wettability to solder and volumetric shrinkage greater than solder. Another patent focuses on the ball grid array package for enhanced stress tolerance, reiterating the importance of his innovative approach to improving solder connections in electronic devices.
Career Highlights
Richard D. James is currently employed at Texas Instruments Corporation, where he continues to develop groundbreaking technologies. His work has been instrumental in advancing the field of electronic packaging, making devices more reliable and efficient.
Collaborations
He has collaborated with notable coworkers, including Leslie Edward Stark and Michael A. Lamson, contributing to a dynamic team focused on innovation and excellence in technology.
Conclusion
Richard D. James exemplifies the spirit of innovation in the field of electronic packaging. His patents and contributions have paved the way for advancements that enhance the performance and reliability of electronic components.