Texas Instruments Corporation

Richard D James

Leslie Edward Stark

Michael A Lamson

The thermomechanical stress sensitivity of ball grid array (BGA) solder connections is significantly reduced, when the solder connections solidify in column-like contours after the reflow process&mdash;a result achieved by using the solder material in tapered openings of a thick sheet-like elastic polymer adhered to the BGA substrate and selected for its characteristics of non-wettability to solder and volumetric shrinkage greater than solder.

Process for fabricating ball grid array package for enhanced stress tolerance

Ball grid array package for enhanced stress tolerance

An electrical connection web, operable at high frequency and configured on a dielectric substrate, comprising a plurality of generally parallel signal lines having graduated width and variable spacings, and said widths and spacings cooperatively selected such that the characteristic impedance of said signal lines is approximately the same for each line of said plurality and approximately constant over the length of each said signal line, whereby signal integrity for each said line is enhanced and cross talk between said lines is reduced.

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Plano, TX, United States of America

Richard D James