The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2003
Filed:
Sep. 01, 2000
Applicant:
Inventors:
Richard D. James, Plano, TX (US);
Leslie E. Stark, Dallas, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/940 ;
Abstract
The thermomechanical stress sensitivity of ball grid array (BGA) solder connections is significantly reduced, when the solder connections solidify in column-like contours after the reflow process—a result achieved by using the solder material in tapered openings of a thick sheet-like elastic polymer adhered to the BGA substrate and selected for its characteristics of non-wettability to solder and volumetric shrinkage greater than solder.