Richard Birch

Title: Richard Birch - Innovator in Embedded Circuit Technology

Introduction

Richard Birch is a notable inventor based in Caldicot, GB. He has made significant contributions to the field of embedded circuit technology. His innovative approach has led to the development of a unique patent that enhances the efficiency and functionality of integrated circuit packages.

Latest Patents

Richard Birch holds a patent for an embedded integrated circuit package. This invention involves a substrate with a patterned conductor layer that defines bond pads. One or more components, typically with upwardly facing contact pads, are mounted on the substrate. The contact pads are wire bonded to the bond pads of the patterned conductor layer. A series of layers, each with one or more cut-outs corresponding to the locations of the components, forms a first solid stack containing cavities that accommodate the components and associated wires. In one embodiment, the layers are fiberglass layers that are cured in the presence of a resin to form a solid body. In another embodiment, the layers are thermoplastic layers. This innovative design improves the integration and performance of electronic devices.

Career Highlights

Richard Birch is currently associated with Microsemi Semiconductor Limited, where he continues to work on advancing semiconductor technologies. His expertise in embedded systems has positioned him as a valuable asset in the industry.

Collaborations

Richard collaborates with Piers Tremlett, contributing to various projects that aim to push the boundaries of semiconductor technology. Their combined efforts have led to advancements in the field.

Conclusion

Richard Birch's contributions to embedded circuit technology exemplify the spirit of innovation. His patent for an embedded integrated circuit package showcases his commitment to enhancing electronic device performance. His work at Microsemi Semiconductor Limited continues to influence the industry positively.