The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Feb. 29, 2016
Microsemi Semiconductor Limited, Caldicot, Monmouthshire, GB;
Piers Tremlett, Coleford, GB;
Richard Birch, Caldicot, GB;
Microsemi Semiconductor Limited, Caldicot, Monmouthsh, GB;
Abstract
An embedded integrated circuit package is made by providing a substrate with a patterned conductor layer defining bond pads. One or more components typically with upwardly facing contact pads are mounted on the substrate. The contact pads are wire bonded to the bond pads of the patterned conductor layer. A series of layers, each with one or more cut-outs corresponding to locations of the components forms a first solid stack containing cavities accommodating the components and associated wires. In one embodiment the layers are fiberglass layers and the layers are cured in the presence of a resin to form a solid body. In another embodiment the layers are thermoplastic layers.