Richard Barnett

Title: Richard Barnett: Innovator in Circuit Board Technology

Introduction

Richard Barnett is a notable inventor based in Houston, TX (US). He has made significant contributions to the field of circuit board technology, holding a total of 3 patents. His innovative designs have paved the way for advancements in high-density system architectures.

Latest Patents

One of Richard Barnett's latest patents is for a high-density universally-configurable system board architecture with dual-use modular mid-board optics (MBOs). This invention provides a system board that can accommodate multiple MBO type configurations without requiring modifications to the layout. The architecture includes a switch application specific integrated circuit (ASIC) assembly and various MBO interfaces, which are designed to work seamlessly with soldered-down or socketized MBO assemblies.

Another significant patent involves a circuit board that features a first and second via, creating an electrical path from the top to the bottom surface of the board. This design includes contact pads that are strategically angled to ensure that the footprint does not cover the vias, enhancing the board's functionality and efficiency.

Career Highlights

Richard Barnett has worked with prominent companies such as Hewlett-Packard Development Company, L.P. and Hewlett Packard Enterprise Development LP. His experience in these organizations has contributed to his expertise in developing innovative circuit board technologies.

Collaborations

Throughout his career, Richard has collaborated with talented individuals, including Kevin B. Leigh and Everett R. Salinas. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Richard Barnett's contributions to circuit board technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry, showcasing the importance of innovation in technology.