Rich Dlesk

Title: Rich Dlesk: Innovator in Circuit Board Manufacturing

Introduction

Rich Dlesk is a notable inventor based in Grayslake, IL (US). He has made significant contributions to the field of circuit board manufacturing. His innovative approach addresses critical challenges faced in cellular manufacturing lines.

Latest Patents

Rich Dlesk holds a patent for a method and circuit board panel designed to mitigate two major issues: board delamination during the singulation from a board panel and board sagging during front-end assembly. His invention substantially eliminates assembly-line delamination and sagging. The method involves punching a number of slots to fit into a circuit board profile. V-grooves are cut along each of the circuit board profiles through the slots and directly opposite on the top and bottom of the circuit board. This optimization of cut-outs and V-groove configurations effectively eliminates tearing and delamination while significantly reducing sagging. He has 1 patent to his name.

Career Highlights

Rich Dlesk is associated with Motorola Corporation, where he applies his expertise in circuit board technology. His work has been instrumental in enhancing manufacturing processes and improving product reliability.

Collaborations

Rich has collaborated with talented coworkers such as Kai X Hu and Xinyu Dou, contributing to innovative solutions in their field.

Conclusion

Rich Dlesk's contributions to circuit board manufacturing demonstrate his commitment to innovation and problem-solving in the industry. His patent reflects a significant advancement in manufacturing technology, showcasing his role as a key inventor.