The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 1998
Filed:
Jun. 28, 1996
Kai X Hu, Cary, IL (US);
Xinyu Dou, Fox River Grove, IL (US);
Chao-Pin Yeh, Schaumburg, IL (US);
Don Dillard, Mundelein, IL (US);
Delbert Juarezl, Grayslake, IL (US);
Gary Mui, Wheeling, IL (US);
Tom Brey, Lake In The Hills, IL (US);
Rich Dlesk, Grayslake, IL (US);
Karl Wyatt, Cary, IL (US);
Dave Roller, Libertyville, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
Board delamination during the singulation from a board panel and board sagging during front-end assembly are two biggest problems encountered in cellular manufacturing lines. The method (700) and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs and v-groove configurations eliminate tearing/delamination and substantially reduce sagging.