Ricardo Geelhaar

Title: Innovator Ricardo Geelhaar and His Contributions to Chip Module Technology

Introduction

Ricardo Geelhaar is an esteemed inventor based in Berlin, Germany, renowned for his innovative contributions in the field of chip module technology. With a patent to his name, Geelhaar has made significant strides within the tech industry, particularly through his affiliation with Pac Tech—Packaging Technologies GmbH.

Latest Patents

Among his groundbreaking works, Ricardo holds a patent titled "Method for producing a chip module." This invention details a sophisticated method for creating chip modules that feature a carrier substrate and at least one chip situated on that substrate. Furthermore, it describes a contact conductor arrangement that efficiently connects chip pads to contacts on the chip module's surface. The process involves securing the chip's front face, which is equipped with chip pads, to the carrier substrate, followed by the structuring of a contact material layer of the substrate to form the contact conductor arrangement.

Career Highlights

Geelhaar's career is marked by his dedicated work at Pac Tech—Packaging Technologies GmbH, where he has played a pivotal role in the advancement of packaging technologies. His expertise in chip module production has been instrumental in the company’s innovations and has contributed to furthering the industry standards in microelectronics packaging.

Collaborations

Ricardo works alongside talented colleagues such as Ghassem Azdasht and Thorsten Teutsch, with whom he shares ideas and develops cutting-edge technologies. This collaborative environment fosters creativity and drives the successful execution of innovative projects within their firm.

Conclusion

In summary, Ricardo Geelhaar stands out as an influential inventor whose work has significantly impacted chip module technology. His patent underscores the importance of innovative methods in the electronics sector, showcasing his dedication to improving and evolving technological standards. His contributions at Pac Tech—Packaging Technologies GmbH and his collaborative efforts with his peers continue to inspire advancements in the field.