Temple Terrace, FL, United States of America

Rex Alan Lee

This inventor holds 1 USPTO granted patent. Top assignee: University of South Florida. Active years: 2001.


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2001

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Rex Alan Lee - Innovator in Integrated Circuit Technology

Introduction

Rex Alan Lee is a notable inventor based in Temple Terrace, FL (US). He has made significant contributions to the field of integrated circuit technology. His innovative approach has led to the development of a unique patent that enhances the production of interconnects in integrated circuit chips.

Latest Patents

Rex Alan Lee holds a patent for a "Laser-programmable interconnect process for integrated circuit chips." This method involves producing an interconnect from a first metal trace, through a dielectric, to a second metal trace. The process includes heating portions of both metal traces to induce thermal expansion and partial melting. This technique allows for the formation of cracks or fissures in the dielectric, enabling the metals to fuse together and create a reliable interconnect. Notably, one of the metal traces may have a square donut shape configuration, which increases the probability of successful interconnection due to the enhanced number of edges available for crack formation.

Career Highlights

Rex Alan Lee is affiliated with the University of South Florida, where he continues to contribute to research and innovation in the field of integrated circuits. His work has garnered attention for its practical applications in modern technology.

Collaborations

Rex has collaborated with Wilfrido Alejandro Moreno, furthering advancements in their shared field of expertise.

Conclusion

Rex Alan Lee's contributions to integrated circuit technology through his innovative patent demonstrate his commitment to advancing the field. His work not only enhances the efficiency of interconnects but also showcases the potential for future developments in integrated circuit design.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
Loading…