The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2001
Filed:
Jul. 07, 1997
Rex Alan Lee, Temple Terrace, FL (US);
Wilfrido Alejandro Moreno, Tampa, FL (US);
University of South Florida, Tampa, FL (US);
Abstract
A method for producing an interconnect from a first metal trace, through a dielectric, to a second metal trace. The method comprises the steps of heating a portion of the first metal trace to cause thermal expansion and at least partial melting thereof and heating a portion of the second metal trace to cause thermal expansion and at least partial melting thereof such that the thermal expansion of the traces causes at least one crack or fissure in the dielectric to be formed between the traces and such that the melting of the traces causes the metals to fuse together through the crack or fissure, thereby producing the interconnect from the first metal trace to the second metal trace. One of the metal traces may comprise a substantially square donut shape configuration having four interior edges portions, wherein the probability of a successful interconnection is increased due to the increased number of edges present on the top layer from which a crack or fissure to the lower layer can form.