Revathi Uma Polisetti

Title: Revathi Uma Polisetti: Innovator in High-Speed Multi-Chip Package Technology

Introduction

Revathi Uma Polisetti is a prominent inventor based in Corvallis, Oregon, USA. She has made significant contributions to the field of semiconductor technology, particularly in the area of multi-chip packaging. With a total of two patents to her name, Revathi stands out as a pioneering figure in her industry.

Latest Patents

Her latest patents focus on advancements in multi-chip packages, specifically methods for ensuring high-speed serial communications between semiconductor dice. The first patent describes a multi-chip package that includes a package substrate with first and second semiconductor dice configured to communicate with one another via a high-speed serial communications protocol. The second patent reiterates this innovative structure, emphasizing the importance of efficient data transfer in modern electronic devices.

Career Highlights

Throughout her career, Revathi has worked with notable companies such as Avago Technologies General IP (Singapore) Pte. Ltd. and Avago Technologies General IP Pte. Ltd. Her experience in these esteemed organizations has provided her with a solid foundation in semiconductor technology and innovation.

Collaborations

Revathi has collaborated with esteemed colleagues in her field, including Michael G. Kelly and Paul G. Chenard. Their collective expertise highlights her ability to thrive in cooperative environments, driving innovation through teamwork.

Conclusion

Revathi Uma Polisetti exemplifies the spirit of innovation in the semiconductor industry. With her patented technologies, she continues to influence the way multi-chip packages are designed, enabling faster and more efficient communications between semiconductor components. As her career progresses, she remains a key figure to watch in the world of technological advancements.