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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7342310 B1

PDFFull Text
Date of Patent:
Mar. 11, 2008

Filed:

May. 07, 2004

Multi-chip package with high-speed serial communications between semiconductor die

Applicants:

Michael G. Kelly, Corvallis, OR (US);

Paul A. Chenard, Corvallis, OR (US);

Revathi Uma Polisetti, Corvallis, OR (US);

Patrick A. Mckinley, Corvallis, OR (US);

Inventors:

Michael G. Kelly, Corvallis, OR (US);

Paul A. Chenard, Corvallis, OR (US);

Revathi Uma Polisetti, Corvallis, OR (US);

Patrick A. Mckinley, Corvallis, OR (US);

Assignee:

Avago Technologies General IP Pte Ltd, Singapore, SG;

Attorney:
Primary Examiner:

Sheila V Clark

Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.

Find Patent Forward Citations

Kelly, Michael. (2008). Multi-chip package with high-speed serial communications between semiconductor die (U.S. Patent No. 7342310). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7342310

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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