Corvallis, OR, United States of America

Patrick A Mckinley

This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Avago Technologies General IP Pte, Ltd.. Active years: 2008.

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: The Innovations of Patrick A. McKinley

Introduction

Patrick A. McKinley is an accomplished inventor based in Corvallis, Oregon. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to multi-chip packages. His work has had a lasting impact on the efficiency and performance of electronic devices.

Latest Patents

One of Patrick A. McKinley's notable patents is for a multi-chip package with high-speed serial communications between semiconductor die. This invention includes a package substrate on which first and second semiconductor die are formed. These semiconductor die are designed to communicate with each other using a high-speed serial communications protocol, enhancing the overall functionality of electronic systems. He holds 1 patent in this area.

Career Highlights

Throughout his career, Patrick has worked with several prominent companies in the technology sector. He has been associated with Avago Technologies, General IP Pte, Ltd., and Marvell. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Patrick has collaborated with notable professionals in his field, including Michael G. Kelly and Paul Chenard. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Patrick A. McKinley is a distinguished inventor whose work in semiconductor technology continues to influence the industry. His innovative patent for a multi-chip package exemplifies his commitment to advancing electronic communication. His contributions are a testament to the importance of innovation in technology.

Profile summary based on public USPTO records.
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