The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2009
Filed:
Jan. 10, 2008
Method of making multi-chip package with high-speed serial communications between semiconductor dice
Applicants:
Michael G. Kelly, Corvalis, OR (US);
Paul G. Chenard, Corvalis, OR (US);
Revathi Uma Polisetti, Corvalis, OR (US);
Patrick A. Mckinley, Corvalis, OR (US);
Inventors:
Michael G. Kelly, Corvalis, OR (US);
Paul G. Chenard, Corvalis, OR (US);
Revathi Uma Polisetti, Corvalis, OR (US);
Patrick A. McKinley, Corvalis, OR (US);
Assignee:
Avago Technologies General IP (Singapore) Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/30 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.