Company Filing History:
Years Active: 2015-2016
Title: The Innovative Contributions of Renee D Garcia
Introduction
Renee D Garcia is a prominent inventor based in Gilbert, AZ (US). She has made significant contributions to the field of integrated circuit packaging, holding 2 patents that showcase her innovative approach to technology.
Latest Patents
One of her latest patents is titled "Integrated circuit package with spatially varied solder resist opening dimension." This invention involves an integrated circuit (IC) package stack that includes a first and second substrate interconnected by solder. The design features solder resist openings (SRO) of mixed lateral dimensions that are spatially varied across the area of the substrates. The SRO dimensions are adjusted between at least two different diameters based on the estimated gap between the substrates, which varies depending on the location within the substrate area. In cases where deflection in at least one substrate affects the conformality between the substrates, a varying solder joint height is achieved from a fixed volume of solder by reducing the lateral dimensioning of the SRO in regions with larger gaps compared to those with smaller gaps. The first substrate can be an IC chip, package substrate, or interposer, while the second substrate may be another IC chip, package substrate, interposer, or printed circuit board (PCB).
Career Highlights
Renee D Garcia is currently employed at Intel Corporation, where she continues to push the boundaries of innovation in integrated circuit technology. Her work has been instrumental in advancing the efficiency and reliability of electronic devices.
Collaborations
Throughout her career, Renee has collaborated with talented individuals such as Tieyu Zheng and Sumit Kumar, contributing to a dynamic and innovative work environment.
Conclusion
Renee D Garcia's contributions to the field of integrated circuit packaging exemplify her dedication to innovation and technology. Her patents reflect a deep understanding of the complexities involved in electronic design, making her a valuable asset to Intel Corporation and the broader tech community.