This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Nitto-Denko Corporation. Active years: 2023.
Company Filing History:
Years Active: 2023
Title: Rena Kojima: Innovator in Thermosetting Materials
Introduction
Rena Kojima is a prominent inventor based in Ibaraki, Japan. She has made significant contributions to the field of materials science, particularly in the development of thermosetting sheets used in semiconductor applications. Her innovative work has garnered attention in the industry and has led to the filing of a patent.
Latest Patents
Rena Kojima holds a patent for a thermosetting sheet, dicing die bonding film, and semiconductor apparatus. The invention provides a thermosetting sheet that includes a thermosetting resin, a thermoplastic resin, a volatile component, and conductive particles. Notably, the thermosetting sheet has an arithmetic average roughness Ra of 0.1 μm or more and 1.2 μm or less, measured in a state before being cured. This innovation is crucial for enhancing the performance and reliability of semiconductor devices.
Career Highlights
Rena Kojima is associated with Nitto-Denko Corporation, a leading company in the field of advanced materials. Her role at the company has allowed her to work on cutting-edge technologies that push the boundaries of material science. With her expertise, she has contributed to the development of products that meet the evolving needs of the semiconductor industry.
Collaborations
Rena collaborates with her coworker, Tomoaki Ichikawa, to further advance their research and development efforts. Their teamwork exemplifies the importance of collaboration in driving innovation and achieving successful outcomes in their projects.
Conclusion
Rena Kojima's contributions to the field of thermosetting materials highlight her role as an influential inventor. Her patent for a thermosetting sheet demonstrates her commitment to advancing technology in the semiconductor industry. Through her work at Nitto-Denko Corporation, she continues to make strides in material science, paving the way for future innovations.