The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Oct. 25, 2021
Applicant:
Nitto Denko Corporation, Ibaraki, JP;
Inventors:
Rena Kojima, Ibaraki, JP;
Tomoaki Ichikawa, Ibaraki, JP;
Assignee:
NITTO DENKO CORPORATION, Ibaraki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); C08J 5/12 (2006.01); C08J 5/18 (2006.01); C08L 33/04 (2006.01); C09K 5/14 (2006.01); H01L 21/683 (2006.01); H01L 23/495 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/38 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B32B 27/20 (2013.01); C08J 5/12 (2013.01); C08J 5/18 (2013.01); C08L 33/04 (2013.01); C09K 5/14 (2013.01); H01L 21/6836 (2013.01); H01L 23/49513 (2013.01); B32B 27/308 (2013.01); B32B 27/38 (2013.01); C08J 2333/04 (2013.01); C08J 2461/08 (2013.01); C08J 2463/02 (2013.01); C08J 2463/04 (2013.01); C08L 2203/30 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73265 (2013.01);
Abstract
Provided in the present invention is a thermosetting sheet including a thermosetting resin, a thermoplastic resin, a volatile component, and conductive particles. The thermosetting sheet has an arithmetic average roughness Ra of 0.1 μm or more and 1.2 μm or less that is measured in a state before being cured.