Ren Liu

Title: Ren Liu: Innovator in Foldable Substrate Technology

Introduction

Ren Liu is an accomplished inventor based in Horseheads, NY (US). He has made significant contributions to the field of materials science, particularly in the development of foldable substrates. His innovative work has led to the granting of a patent that showcases his expertise and creativity.

Latest Patents

Ren Liu holds a patent for "Foldable substrates having a cavity filled with a polymer and methods of making." This invention involves foldable substrates that consist of a first portion, a second portion, and a central portion positioned between them. The design includes a first transition region with a specific central surface area and average angles that range from about 176.10 to about 179.9°. The methods described in the patent include the use of an etch mask over the substrate's surface before etching, which may comprise a first polymer layer and a plurality of ink-jet printed shapes. This innovative approach enhances the functionality and versatility of foldable substrates.

Career Highlights

Ren Liu is currently employed at Corning Incorporated, a leading company in glass and ceramics technology. His work at Corning has allowed him to explore and develop advanced materials that have practical applications in various industries. With a focus on innovation, Liu continues to push the boundaries of what is possible in substrate technology.

Collaborations

Ren Liu has collaborated with talented individuals such as Gabriel Pierce Agnello and Matthew Wade Fenton. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Ren Liu is a notable inventor whose work in foldable substrate technology exemplifies innovation and creativity. His patent and contributions to Corning Incorporated highlight his commitment to advancing materials science. Ren Liu's achievements serve as an inspiration for future inventors in the field.