This inventor holds 1 USPTO granted patent. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2022.
Company Filing History:
Years Active: 2022
Title: Ren-Hung Chou: Innovator in Semiconductor Packaging
Introduction
Ren-Hung Chou is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor package structure.
Latest Patents
Ren-Hung Chou holds 1 patent for a semiconductor package structure. This structure includes a substrate that features a first ground layer. The first ground layer has a body and a first tooth protruding from a side of the body. Notably, the first tooth has a first lateral side that is inclined relative to the side of the body when viewed from above.
Career Highlights
Chou is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to push the boundaries of semiconductor packaging technology. His work has been instrumental in enhancing the efficiency and performance of semiconductor devices.
Collaborations
Throughout his career, Ren-Hung Chou has collaborated with notable colleagues, including Jaw-Ming Ding and Yi-Hung Lin. These partnerships have fostered innovation and have contributed to the advancement of semiconductor technologies.
Conclusion
Ren-Hung Chou's contributions to semiconductor packaging exemplify his dedication to innovation in technology. His patent and collaborative efforts highlight his role as a key figure in the semiconductor industry.