Bromont, Canada

Rejean Paul Levesque

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rejean Paul Levesque. Retrieved from https://idiyas.com/inventor/rejean-paul-levesque

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Rejean Paul Levesque: Innovator in Laminate Characterization

Introduction

Rejean Paul Levesque is a notable inventor based in Bromont, Canada. He has made significant contributions to the field of laminate characterization, showcasing his expertise through innovative methods that enhance yield loss analysis.

Latest Patents

Levesque holds a patent for a method titled "Characterizing laminate shape." This patent outlines a process for sorting laminates by characterizing their shapes through measurements. The method involves assembling laminates to establish a relationship between their shapes and yield loss, characterizing second shapes from fewer measurements, and analyzing changes in these relationships to optimize the sorting process.

Career Highlights

Rejean Paul Levesque is associated with International Business Machines Corporation (IBM), where he applies his skills in research and development. His work focuses on improving manufacturing processes and enhancing product quality through innovative solutions.

Collaborations

Levesque has collaborated with colleagues such as Sylvain Pharand and Isabelle Paquin, contributing to a dynamic team environment that fosters innovation and creativity.

Conclusion

Rejean Paul Levesque's contributions to laminate characterization reflect his commitment to innovation and excellence in engineering. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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