Reid E Messersmith

Title: Reid E Messersmith: Innovator in Adhesive Technologies

Introduction

Reid E Messersmith is a notable inventor based in Jessup, MD (US), recognized for his contributions to adhesive technologies. He holds three patents that showcase his innovative approach to enhancing adhesive performance through advanced materials.

Latest Patents

One of his latest patents is focused on microcapsules for use with polyurethane and epoxy adhesives. This invention includes a shell composed of nanoclay platelets and a polyurea product formed through interfacial polymerization. The core composition encapsulated by the shell contains a base catalyst for polyurethane formation, a polyol, and a hydrophilic solvent. Another significant patent involves a bifunctional linker for bisconjugation, which is utilized in cycloaddition to tether two entities, such as a protein or antibody, to an active agent, forming a bisconjugate. This linker can also create a conjugate that adheres to surfaces, with applications in imaging, diagnostics, and therapeutics.

Career Highlights

Reid E Messersmith is affiliated with The Johns Hopkins University, where he continues to advance research in adhesive technologies. His work has significantly impacted the field, particularly in the development of innovative materials that enhance adhesive properties.

Collaborations

He collaborates with esteemed colleagues, including Christopher M Hoffman, Jr and Mairead E Bartlett, contributing to a dynamic research environment that fosters innovation.

Conclusion

Reid E Messersmith's inventive work in adhesive technologies exemplifies the intersection of science and practical application. His patents reflect a commitment to advancing materials that improve adhesive performance, making a lasting impact in the field.