Rees Winters

Title: Rees Winters: Innovator in Electronic Packaging

Introduction

Rees Winters is a notable inventor based in Glendale, AZ (US). He has made significant contributions to the field of electronic packaging, holding a total of 3 patents. His work focuses on innovative solutions that enhance the functionality and efficiency of electronic devices.

Latest Patents

Among his latest patents is the "Through mold interconnect drill feature." This invention includes embodiments that describe electronic packages comprising a package substrate, a first die electrically coupled to the package substrate, and a mold layer over the package substrate and around the first die. Additionally, the electronic package features a through mold opening through the mold layer, and a through mold interconnect (TMI) in the through mold opening, with the center of the TMI offset from the center of the through mold opening.

Career Highlights

Rees Winters is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His role at Intel allows him to work on cutting-edge technologies that shape the future of electronic devices.

Collaborations

Throughout his career, Rees has collaborated with talented individuals such as Robert M Nickerson and Purushotham Kaushik Muthur Srinath. These collaborations have contributed to the development of innovative solutions in electronic packaging.

Conclusion

Rees Winters is a prominent figure in the field of electronic packaging, with a focus on innovative designs that improve electronic devices. His contributions through patents and collaborations highlight his commitment to advancing technology.