This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: The Boeing Company. Active years: 2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015
Title: Innovations by Raymond M Rademeyer
Introduction
Raymond M Rademeyer is an accomplished inventor based in St. Louis, MO. He is known for his innovative contributions to the field of engineering, particularly in the design of forming dies. His work has led to advancements that enhance manufacturing processes.
Latest Patents
One of Rademeyer's notable patents is for laminated forming dies. This patent describes a die that comprises a primary plate and secondary plates. The secondary plates feature through weld holes formed along a specific direction. Importantly, the through weld holes of adjacent secondary plates do not overlap when viewed in the direction along which the through weld holes are formed. The primary plate is coupled to at least one secondary plate abutting the primary plate by first welds located in the through weld holes. Additionally, the secondary plates that abut each other are coupled by second welds located in the through weld holes. This innovative design improves the efficiency and effectiveness of forming dies in manufacturing.
Career Highlights
Raymond M Rademeyer is currently employed at The Boeing Company, where he applies his expertise in engineering and innovation. His work at Boeing has allowed him to contribute to significant projects and advancements in aerospace technology.
Collaborations
Throughout his career, Rademeyer has collaborated with talented individuals such as Ryan Lee Hanks and Larry Dean Hefti. These collaborations have fostered a creative environment that encourages innovation and the development of new ideas.
Conclusion
Raymond M Rademeyer is a notable inventor whose work in laminated forming dies exemplifies his commitment to innovation in engineering. His contributions continue to impact the manufacturing industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
