The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Dec. 13, 2013
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Ryan L. Hanks, Maucoupin, IL (US);

Raymond M. Rademeyer, St. Louis Co., MO (US);

Larry D. Hefti, Auburn, WA (US);

Steve R. McNamara, Saint Charles, MO (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 37/02 (2006.01); B21D 37/20 (2006.01); B21D 53/00 (2006.01); B23P 15/24 (2006.01); B21J 13/02 (2006.01);
U.S. Cl.
CPC ...
B21D 37/02 (2013.01); B21D 37/20 (2013.01); B21D 53/00 (2013.01); B21D 37/205 (2013.01); B23P 15/246 (2013.01); B21J 13/02 (2013.01);
Abstract

One aspect of the disclosure relates to a die comprising a primary plate and secondary plates. The secondary plates comprise through weld holes formed along a direction. The through weld holes of adjacent secondary plates do not overlap when viewed in the direction along which the though weld holes are formed. The primary plate is coupled to at least one secondary plate abutting the primary plate by first welds located in the through weld holes. The secondary plates abutting each other are coupled by second welds located in the through weld holes.


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