Raymond John Donohoe

Title: **Innovations of Raymond John Donohoe in Silicon-On-Insulator Technology**

Introduction

Raymond John Donohoe, an accomplished inventor based in Dresden, Germany, has made significant contributions to the field of semiconductor technology. With two patents to his name, his work primarily focuses on enhancing the efficiency and effectiveness of silicon-on-insulator (SOI) transfer wafers, a vital component in modern electronics.

Latest Patents

Raymond's latest innovations include a patented method for edge removal of silicon-on-insulator transfer wafers. This technique involves polishing a silicon-on-insulator transfer wafer featuring a front surface with a circumferential lip surrounding a circular recess. In one implementation, the circular recess is filled with a spin-on-glass material to mask it. Following this, the front surface is treated with an etchant that preferentially etches away the circumferential lip, leaving the recess unharmed. Once the etching is complete, the spin-on glass is removed, and the wafer's front surface is polished to enhance its performance. Alternative methods described in his patent also include applying increased pressure to the circumferential lip during polishing or using a pressurized fluid jet directed at the base of the lip for more effective edge removal.

Career Highlights

Raymond John Donohoe is currently associated with Applied Materials, Inc., a leading company in the semiconductor manufacturing equipment and services sector. His innovative work not only showcases his engineering expertise but also positions him as a pivotal figure in advancing SOI technology, which is crucial for the next generation of electronic devices.

Collaborations

Throughout his career, Raymond has collaborated with notable professionals such as Krishna Vepa and Paul V. Miller. These partnerships highlight the importance of teamwork and shared expertise in driving significant advancements in semiconductor technology.

Conclusion

Raymond John Donohoe's contributions to the field of semiconductor technology exemplify the spirit of innovation and the pursuit of excellence. His patented methods for enhancing silicon-on-insulator transfer wafers not only reflect his technical ingenuity but also contribute to the broader evolution of electronic technologies. As he continues his work at Applied Materials, Inc., the impact of his inventions is sure to resonate within the industry for years to come.