This inventor holds 1 USPTO granted patent. Top assignee: Industrial Technology Research Institute. Active years: 2003.
Company Filing History:
Years Active: 2003
Title: Ray-Iun Liu: Innovator in Copper Alloy Technology
Introduction
Ray-Iun Liu is a distinguished inventor based in Hsinchu, Taiwan. He is known for his significant contributions to the field of materials science, particularly in the development of high-strength and high-conductivity copper alloys. His innovative work has implications for various applications, especially in the electronics industry.
Latest Patents
Ray-Iun Liu holds a patent for a high-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy designed for use in leadframes. This alloy comprises 0.5 to 2.5 wt % of Ni, 0.5 to 2.5 wt % of Co, 0.5 to 0.8 wt % of Si, and 0.05 to 0.15 wt % of either Mg or P or both, with the balance being Cu. The specific ratios of Co, Ni, and Si are critical, as they enhance the alloy's electrical conductivity to greater than 65% IACA, surpassing that of the commercially available C7025 copper alloy. Additionally, it maintains a tensile strength greater than 600 MPa, making it ideal for high pin-number integrated circuit applications.
Career Highlights
Ray-Iun Liu is affiliated with the Industrial Technology Research Institute, where he has been instrumental in advancing research and development in materials technology. His work has not only contributed to academic knowledge but has also led to practical applications in the industry.
Collaborations
Some of his notable coworkers include I-Ching Lee and Jin-Yaw Liu, who have collaborated with him on various projects related to materials science and engineering.
Conclusion
Ray-Iun Liu's innovative contributions to the field of copper alloys exemplify the importance of research and development in advancing technology. His patented work continues to influence the electronics industry, showcasing the potential of high-performance materials.