The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2003
Filed:
Sep. 21, 2001
Jin-Yaw Liu, Hsinchu, TW;
Yu-Lian Sha, Yeong-Ho, TW;
I-Ching Lee, Hua-Lien, TW;
Mao-Ying Teng, Hsinchu, TW;
Ray-Iun Liu, Hsinchu, TW;
Ren-Der Jean, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A high-strength and high-conductivity copper alloy is disclosed which contains essentially of: (a) from 0.5 to 2.5 wt % of Ni; (b) from 0.5 to 2.5 wt % of Co; (c) from 0.5 to 0.8 wt % of Si; (d) from 0.05 to 0.15 wt % of either Mg or P or both; and (e) the balance of Cu. The amounts of Co, Ni, and Si satisfy the following equations: 2%≦(Ni+Co)≦4%, and 0.8≦(Ni/4+Co/6)/Si≦1.2. The new copper alloy exhibits substantially improved electrical conductivity, greater than 65% IACA, than the commercially available C7025 copper alloy, while maintaining a satisfactory tensile strength (greater than 600 MPa), and, thus, can be most advantageously used for preparing leadframes for use in high pin-number (greater than 100 pins) IC application.