I-Ching Lee

Title: I-Ching Lee: Innovator in Copper Alloy Technology

Introduction

I-Ching Lee is a notable inventor based in Hua-Lien, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of high-strength and high-conductivity copper alloys. His innovative work has implications for various applications, especially in the electronics industry.

Latest Patents

I-Ching Lee holds a patent for a "High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes and method of making the same." This patent describes a copper alloy that includes specific percentages of nickel, cobalt, silicon, and either magnesium or phosphorus. The alloy exhibits improved electrical conductivity, exceeding 65% IACA, while maintaining a tensile strength greater than 600 MPa. This makes it particularly suitable for leadframes in high pin-number integrated circuit applications.

Career Highlights

I-Ching Lee is associated with the Industrial Technology Research Institute, where he has been involved in research and development of advanced materials. His work has not only advanced the understanding of copper alloys but has also contributed to the practical applications of these materials in the industry.

Collaborations

I-Ching Lee has collaborated with notable colleagues such as Jin-Yaw Liu and Yu-Lian Sha. Their combined expertise has fostered innovation and development in the field of materials science.

Conclusion

I-Ching Lee's contributions to the development of high-strength and high-conductivity copper alloys highlight his role as a key innovator in materials science. His work continues to influence the electronics industry and paves the way for future advancements in technology.