Mao-Ying Teng

Title: Mao-Ying Teng: Innovator in Copper Alloy Technology

Introduction

Mao-Ying Teng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of high-strength and high-conductivity copper alloys. His work is essential for advancing technologies in integrated circuits.

Latest Patents

Mao-Ying Teng holds a patent for a "High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes and method of making the same." This innovative copper alloy comprises: (a) from 0.5 to 2.5 wt % of Ni; (b) from 0.5 to 2.5 wt % of Co; (c) from 0.5 to 0.8 wt % of Si; (d) from 0.05 to 0.15 wt % of either Mg or P or both; and (e) the balance of Cu. The alloy demonstrates improved electrical conductivity, exceeding 65% IACA, compared to the commercially available C7025 copper alloy, while maintaining a tensile strength greater than 600 MPa. This makes it particularly suitable for leadframes in high pin-number integrated circuit applications.

Career Highlights

Mao-Ying Teng is affiliated with the Industrial Technology Research Institute, where he has been instrumental in research and development projects. His expertise in copper alloys has positioned him as a key figure in advancing material technologies.

Collaborations

Mao-Ying Teng has collaborated with notable colleagues, including Jin-Yaw Liu and Yu-Lian Sha. Their combined efforts have contributed to the success of various research initiatives in the field of materials science.

Conclusion

Mao-Ying Teng's innovative work in copper alloy technology has significant implications for the electronics industry. His contributions continue to pave the way for advancements in integrated circuit applications.