Ray A Bouvier

Title: Ray A. Bouvier and His Flexible Solder Socket Invention.

Introduction

Ray A. Bouvier is an inventor associated with Palm Bay, Florida, and Harris Corporation. His work includes a patent for a flexible solder socket designed to connect a leadless integrated circuit package to a printed circuit board. Bouvier is credited with 1 patent.

Latest Patents

Bouvier’s patent, “Flexible Solder Socket for Connecting Leadless Integrated Circuit,” describes a connector arrangement intended to reduce thermal stress and vibration in the connection between an integrated circuit chip and a printed circuit board.

The design uses substantially L-shaped flexible connectors arranged to match the contact areas around the edge of the chip package. The connectors’ lower portions are soldered to conductive paths on the circuit board, while their upper portions bend around an insulated carrier and connect to contact layers on the chip. The carrier is left unbonded near the bend, allowing the connector to flex parallel to the board’s surface. This flexibility helps limit stress on the soldered connections.

Career Highlights

Bouvier’s patent reflects work on electronic packaging and reliable circuit-board connections. The flexible socket addresses mechanical and thermal stresses that can affect leadless integrated circuit assemblies.

Collaborations

Bouvier’s listed coworker is Leonard T. Hesch, Jr. The patent’s technical approach centers on the flexible connector arrangement and its role in connecting the chip package to the printed circuit board.

Conclusion

Ray A. Bouvier’s patented flexible solder socket offers a design approach for reducing stress in leadless integrated circuit connections, highlighting his contribution to electronic interconnection technology.