Flexible solder socket for connecting leadless integrated circuit

Abstract

A connector arrangement for interconnecting a leadless integrated circuit package to a printed circuit board by means of a flexible solder socket, for eliminating the problems of thermal stress and vibration in the chip-to-printed circuit board connection. The arrangement includes a plurality of substantially L-shaped flexible connectors arranged in a pattern along the edge of an insulated substrate that coincides with the arrangement of chip contact areas on the periphery of the integrated circuit package that is to be connected to the printed circuit board. Bottom portions of the L-shaped flexible connectors are soldered to the conductor highways on the printed circuit board. The upper leg portion of the L-shaped flexible joint connector member is bent around the edge of the insulated carrier and contacts chip contact layers along the edge of the integrated circuit chip. In the region of the edge of the insulated carrier substrate where the L-shaped member is bent, there is no bonding between the substrate and the L-shaped flexible connector, permitting the upper leg of the L-shaped flexible connector to flex in a direction parallel to the surface of the printed circuit board. A solder connection is provided between the contact layers on the edge of the integrated circuit chip and the upper arm of the L-shaped flexible connector. Those portions of the L-shaped flexible connector which are soldered to either the chip or the board undergo substantially no stress.