This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Ravindra Tanikella: Inventor in Glass-Core Packaging Technology
Introduction
Ravindra Tanikella is an inventor based in Chandler, Arizona, and is associated with Intel Corporation. His work includes an invention addressing the protection of glass components used in package substrates.
Latest Patents
Tanikella is credited with 1 patent: “Protective Coating on an Edge of a Glass Core.” The patent describes a protective coating applied to the edge of a glass layer, particularly a glass core within a package substrate. The coating is designed to protect the glass edge and fill cracks, helping reduce cracking caused by stresses during manufacturing or operation.
Career Highlights
Tanikella’s patent work focuses on improving the durability of glass-core package substrates. The described coating offers a way to address edge damage and cracking in glass layers exposed to mechanical stress.
Collaborations
The patent lists Rahul N. Manepalli and Gang Duan among Tanikella’s coworkers. Their shared association with Intel Corporation reflects a collaborative environment for developing packaging technologies.
Conclusion
Ravindra Tanikella’s patented protective coating addresses a specific reliability challenge in glass-core packaging by helping shield glass edges and reduce stress-related cracking.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile