Phoenix, AZ, United States of America

Raul A Arellano

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Raul A Arellano. Retrieved from https://idiyas.com/inventor/raul-a-arellano

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 32(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: The Innovations of Raul A. Arellano

Introduction

Raul A. Arellano is a notable inventor based in Phoenix, AZ. He has made significant contributions to the field of packaging technology, particularly with his innovative designs that enhance product durability and functionality.

Latest Patents

One of his key patents is the "Mass Reflowable Windowed Package." This invention is designed to withstand the mass reflow process, where the entire package is subjected to solder reflow temperatures. In one embodiment, the package features a ceramic frame and a glass window, providing both strength and visibility for the contents inside. Raul holds 1 patent for this innovative design.

Career Highlights

Raul A. Arellano is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has allowed him to explore and develop cutting-edge packaging solutions that meet the demands of modern electronics.

Collaborations

Throughout his career, Raul has collaborated with talented individuals such as Kabul S. Sengupta and Carl E. Sklenicka. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Raul A. Arellano's contributions to the field of packaging technology exemplify the spirit of innovation. His work not only enhances product performance but also sets new standards in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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