Randolph Estal Flauta

Title: Randolph Estal Flauta and Semiconductor Die Singulation

Introduction

Randolph Estal Flauta is an inventor associated with Nexperia B.V. and based in Hong Kong, China. His patent work concerns semiconductor manufacturing, specifically separating individual dies from a processed wafer.

Latest Patents

Flauta is named on 1 patent: “Method of Singulation of Dies from a Wafer.” The invention describes a process for separating dies along saw streets that run in multiple directions. It uses plasma dicing from the wafer’s topside to a depth reaching the interface between the semiconductor layer and the backside coating. The remaining metallization layers are then etched using a mask aligned with the saw streets, completing the singulation process.

Career Highlights

Flauta’s listed patent reflects work on wafer processing and die separation, important steps in semiconductor fabrication. His affiliation with Nexperia B.V. connects this work to a company active in the semiconductor industry.

Collaborations

Flauta’s listed coworkers include Kan Wae Lam and Wai Hung William Hor. The patent’s technical subject also reflects collaborative expertise in semiconductor materials and manufacturing processes.

Conclusion

Randolph Estal Flauta’s patent focuses on a method for singulating semiconductor dies through plasma dicing and etching, contributing to the development of wafer-processing techniques.