Emmaus, PA, United States of America

Ramani Tatikola

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ramani Tatikola. Retrieved from https://idiyas.com/inventor/ramani-tatikola

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: The Innovations of Ramani Tatikola

Introduction

Ramani Tatikola is an accomplished inventor based in Emmaus, Pennsylvania. He is known for his significant contributions to the field of multi-chip modules, particularly through his innovative patent that enhances chip-to-chip communication.

Latest Patents

Tatikola holds a patent for a chip-to-chip interface of a multi-chip module (MCM). This invention includes bidirectional data links for transmitting data signals and a direction indicator bit, which allows for real-time switching of the direction of the bidirectional data links. Additionally, it features a clock link for transmitting a common clock signal, ensuring that the data and clock links are comprised of conductive traces laid out to be of substantially equal length. The patent also includes a clock driver means with a digitally programmable clock signal delay.

Career Highlights

Ramani Tatikola is currently employed at Intel Corporation, where he continues to push the boundaries of technology and innovation. His work has been instrumental in advancing the capabilities of multi-chip modules, making them more efficient and effective in data transmission.

Collaborations

Tatikola has collaborated with notable colleagues, including Kameran Azadet and Wee Liew, who have contributed to his projects and innovations.

Conclusion

Ramani Tatikola's work exemplifies the spirit of innovation in the tech industry. His contributions to multi-chip modules have paved the way for advancements in chip communication technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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