This inventor holds 1 USPTO granted patent. Top assignee: Seagate Technology Incorporated. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: Ralph Marquart: Inventor in Microelectronic Bonding
Introduction
Ralph Marquart is an inventor associated with Hudson, Wisconsin, and Seagate Technology Incorporated. His patent describes a technique for forming small gold-wire ball bonds without heating the underlying bonding pad.
Latest Patents
Marquart’s listed patent, “Ambient Temperature Ball Bond,” presents a method for creating a ball bond with gold wire less than one thousandth of an inch in diameter. The technique uses ultrasonic bonding energy and does not require heating the bonding pad. This approach can support particularly small pads positioned close to neighboring microelectronic structures, where other bonding methods may be unsuitable because of their shallow take-off angles. Marquart is credited with 1 patent in the information provided.
Career Highlights
Marquart is associated with Seagate Technology Incorporated. His patented work addresses a specialized microelectronics manufacturing challenge: making reliable wire bonds in confined spaces while avoiding heat at the bonding pad.
Collaborations
Leping Li and Pramit P. Parikh are identified as Marquart’s coworkers. The information provided does not specify their roles in the patent or their contributions to the described technology.
Conclusion
Ralph Marquart’s “Ambient Temperature Ball Bond” patent describes an ultrasonic bonding approach designed for small, closely spaced microelectronic structures without heating the underlying pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile